Molex’s award-winning Mirror Mezz Pro provides 224G
solutions for next-generation data centers
Recently, at the 10th "Smart Internet of Things, New Trend" IoT Conference issued
by ElecFans, Molex used Mirror Mezz Pro And the Mirror Mezz Enhanced high-speed
buckle board connection won the 2023IoT #IoT# Product Award! Mirror Mezz Series
onnectors provide innovative high-speed performance connectors for next-generation
data centers to support the growing demand for demanding application environments.
Long data requirements.
As generative AI and machine learning continue to advance, the need for powerful, high-performance data centers has never been higher. To satisfy complexcomputing
requirements, today's data centers have to extend their system architecture to use the
PAM-4 modulation scheme on each differential pair, to support data transfer rates of 224 Gbps.
In response to this trend, Molex took the lead in launching a chip-to-chip 224 Gbps-PAM4 product portfolio to support the next generation of digital data. According to the center. Inception, CX2-DS and Mirror Mezz Enhanced are key solutions in the new product portfolio
The solution is suitable for emerging hardware architectures. Let’s explore 224 Gbps-PAM4 interconnect options to gain a clear understanding of these aspects Some unique functions and features of the case.
by ElecFans, Molex used Mirror Mezz Pro And the Mirror Mezz Enhanced high-speed
buckle board connection won the 2023IoT #IoT# Product Award! Mirror Mezz Series
onnectors provide innovative high-speed performance connectors for next-generation
data centers to support the growing demand for demanding application environments.
Long data requirements.
As generative AI and machine learning continue to advance, the need for powerful, high-performance data centers has never been higher. To satisfy complexcomputing
requirements, today's data centers have to extend their system architecture to use the
PAM-4 modulation scheme on each differential pair, to support data transfer rates of 224 Gbps.
In response to this trend, Molex took the lead in launching a chip-to-chip 224 Gbps-PAM4 product portfolio to support the next generation of digital data. According to the center. Inception, CX2-DS and Mirror Mezz Enhanced are key solutions in the new product portfolio
The solution is suitable for emerging hardware architectures. Let’s explore 224 Gbps-PAM4 interconnect options to gain a clear understanding of these aspects Some unique functions and features of the case.
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